The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Aug. 08, 2022
Applicant:

Reophotonics, Ltd., Modiin, IL;

Inventor:

Michael Zenou, Hashmonaim, IL;

Assignee:

Reophotonics, Ltd., Modiin, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H05K 1/115 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/107 (2013.01);
Abstract

In a method for filling through-holes of a substrate with a metal paste, an upper lamination foil is secured to the top surface of the substrate and a lower lamination foil is secured to the bottom surface of the substrate. A laser beam is used to generate a first plurality of holes in the upper lamination foil, and a second plurality of holes in the lower lamination foil. Respective locations of the first and second plurality of holes are aligned with the through-holes of the substrate. Metal paste is applied into the through-holes through the first plurality of holes using a squeegee or a knife. Any metal paste that is pressed out from the second plurality of holes may be scraped off by the squeegee or the knife and recycled. Finally, the upper and lower lamination foils may be removed from the substrate.


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