The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Dec. 10, 2019
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hideo Nakagawa, Omihachiman, JP;

Yoshinori Ogawa, Kamakura, JP;

Nobuaki Matsumoto, Takasaki, JP;

Shuhei Ueda, Joetsu, JP;

Keiji Ohori, Saitama, JP;

Kohei Otake, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25B 11/00 (2006.01); H05K 13/04 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H05K 13/0452 (2013.01); H10H 20/018 (2025.01);
Abstract

A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.


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