The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
May. 11, 2022
Unimicron Germany Gmbh, Geldern, DE;
UNIMICRON GERMANY GMBH, Geldern, DE;
Abstract
A method for producing a printed circuit board having at least one embedded electronic component, in which a support layer and a positioning layer having a recess somewhat larger than the corresponding base area of the printed circuit board module are provide, the positioning layer is placed on the support layer and the printed circuit board module inserted into the recess in the positioning layer. The printed circuit board module is positioned without soldering or gluing, and at least one electrically insulating layer placed on the printed circuit board module and the positioning layer surrounding the printed circuit board module. An electrically conductive layer is placed on the at least one electrically insulating layer covering the printed circuit board module, and the layer sequence is pressed. The bores in the pressed layer sequence are metallized.