The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Mar. 01, 2023
Applicant:
Mektec Corporation, Tokyo, JP;
Inventors:
Shunsuke Aoyama, Tokyo, JP;
Masanori Hirata, Tokyo, JP;
Assignee:
MEKTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/61 (2011.01); H01R 12/62 (2011.01); H01R 12/63 (2011.01); H05K 1/11 (2006.01); H01R 35/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H01R 12/61 (2013.01); H01R 12/62 (2013.01); H01R 12/63 (2013.01); H01R 35/025 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09672 (2013.01);
Abstract
Provided is a flexible printed wiring board including: a base film which is an insulating layer; a first conductor layer; a second conductor layer; and a through-hole, in which the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and the through-hole is provided so as to penetrate the base film and electrically connect the first conductor layer and the second conductor layer to each other, and the second conductor layer has a solderable region.