The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Jun. 03, 2022
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Unnikrishnan Vadakkanmaru Veedu, Chandler, AZ (US);

Silvia Anali Soto De La Torre, Seattle, WA (US);

Alexander Lyakhov, Portland, OR (US);

Krishna Bharath, Phoenix, AZ (US);

Fenghua Shen, Bellevue, WA (US);

Madhavi Tadepalli, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/467 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0262 (2013.01); H01L 23/467 (2013.01); H05K 1/0203 (2013.01); H05K 7/20154 (2013.01);
Abstract

Technology is disclosed for a computing system with a printed circuit board having a top and bottom; an integrated circuit component coupled to the top of the board; a passive heat exchanger coupled to the top of the board and spaced from the integrated circuit component; at least one electronic component coupled to the printed circuit board below the top of the printed circuit board; and at least one heat pipe having an evaporator end adjacent the electronic component and extending away from the evaporator end along the bottom of the board to a condenser end above the top of the board, the condenser end being thermally coupled to the passive heat exchanger on the top of the board; wherein heat from electronic component is moved away from the electronic component and the integrated circuit component to the passive heat exchanger.


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