The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Sep. 27, 2022
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Tarek Gebrael, Champaign, IL (US);

Arielle R. Gamboa, Urbana, IL (US);

Jiaqi Li, Urbana, IL (US);

Nenad Miljkovic, Urbana, IL (US);

Shayan Aflatounian, Urbana, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); C23C 14/04 (2006.01); C23C 14/20 (2006.01); C23C 14/24 (2006.01); C23C 14/34 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C23C 28/02 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); C23C 14/042 (2013.01); C23C 14/205 (2013.01); C23C 14/24 (2013.01); C23C 14/34 (2013.01); C23C 18/1605 (2013.01); C23C 18/38 (2013.01); C23C 28/023 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 3/22 (2013.01);
Abstract

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.


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