The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Mar. 30, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Wei-Chen Pan, New Taipei, TW;

Chun-Wei Wang, Keelung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76221 (2013.01); H01L 21/02043 (2013.01); H01L 21/76235 (2013.01);
Abstract

The present application discloses a method for fabricating the semiconductor device. The method for fabricating the semiconductor device includes forming a first dielectric layer on a substrate; forming a feature opening to exposing the substrate; performing a pre-cleaning treatment including a pre-cleaning solution to the feature opening; performing a cleaning process to the feature opening; and forming a conductive feature in the feature opening. The pre-cleaning solution includes a chelating agent and a corrosion inhibitor.


Find Patent Forward Citations

Pan, Wei-Chen. (2025). Method for fabricating semiconductor device with chelating agent (U.S. Patent No. 12341054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12341054

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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