The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Apr. 13, 2022
Applicant:
Zeus Co., Ltd., Hwaseong-si, KR;
Inventors:
Assignee:
ZEUS CO., LTD., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01); B08B 3/12 (2006.01); B08B 13/00 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B08B 3/02 (2013.01); B08B 3/022 (2013.01); B08B 3/08 (2013.01); B08B 3/12 (2013.01); B08B 3/123 (2013.01); B08B 13/00 (2013.01); H01L 21/02076 (2013.01); H01L 21/304 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/6836 (2013.01); H01L 21/68728 (2013.01); H01L 21/68792 (2013.01); B08B 2203/0288 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.