The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Sep. 08, 2020
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Sachihiro Nishide, Tomioka, JP;

Tetsuya Nakamura, Tomioka, JP;

Nobuhito Yanagihara, Tomioka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 1/0237 (2006.01); C22C 5/06 (2006.01); H01H 50/44 (2006.01); H01H 50/54 (2006.01);
U.S. Cl.
CPC ...
H01H 1/0237 (2013.01); C22C 5/06 (2013.01); H01H 50/44 (2013.01); H01H 50/546 (2013.01);
Abstract

A DC high-voltage relay with at least one contact pair including a movable contact and a fixed contact, the contact pair having a contact force and/or an opening force of 100 gf or more, having a rated voltage of 48 V or more, the movable contact and/or the fixed contact includes a Ag oxide-based contact material. Metal components contain at least one metal M essentially containing Zn, and a balance being Ag and inevitable impurity metals, and the contact material has a content of the metal M of 0.2% by mass or more and 8% by mass or less based on a total mass. The contact material has a material structure in which one or more oxides of the metal M having an average particle size of 0.01 μm or more and 0.4 μm or less are dispersed in a matrix including Ag or a Ag alloy.


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