The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Dec. 14, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jin Soo Park, Suwon-si, KR;
Eui Hyun Jo, Suwon-si, KR;
Jun Hyeong Kim, Suwon-si, KR;
Ha Jeong Kim, Suwon-si, KR;
Hyun Hee Gu, Suwon-si, KR;
Woo Kyung Sung, Suwon-si, KR;
Myung Jun Park, Suwon-si, KR;
Byung Jun Jeon, Suwon-si, KR;
Chul Seung Lee, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.