The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Apr. 20, 2023
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Takaaki Sato, Tokyo, JP;

Akihiro Masuda, Tokyo, JP;

Norihisa Ando, Tokyo, JP;

Shinya Ito, Tokyo, JP;

Kosuke Yazawa, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01);
Abstract

An electronic device includes a chip component, a case, a resin, and a conductive terminal. The chip component includes a terminal electrode. The case includes an accommodation recess for accommodating the chip component. The resin is filled in the accommodation recess. The conductive terminal is attachable to the case. The conductive terminal includes an inner electrode portion disposed in the accommodation recess and connected to the terminal electrode. The inner electrode portion includes a space formation portion forming a filling space for a conductive agent with an outer surface of the chip component at a position closer to a bottom surface than to an opening of the accommodation recess.


Find Patent Forward Citations

Loading…