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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12340919 B1

PDFFull Text
Date of Patent:
Jun. 24, 2025

Filed:

Nov. 28, 2019

Silver paste

Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Kousuke Nishimura, Tosu, JP;

Naoto Shindo, Tosu, JP;

Hiroshi Mashima, Tosu, JP;

Assignee:

SHOEI CHEMICAL INC., Tokyo, JP;

Attorney:

Alleman Hall & Tuttle LLP

Primary Examiner:

Robert S Jones, Jr

Assistant Examiner:

Zhen Liu

Int. Cl.
CPC ...
B22F 1/107 (2022.01); B22F 1/00 (2022.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/06 (2022.01); B22F 1/102 (2022.01); B22F 1/103 (2022.01); C08K 3/08 (2006.01); H01B 1/22 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/00 (2013.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 1/06 (2022.01); B22F 1/102 (2022.01); B22F 1/103 (2022.01); B22F 1/107 (2022.01); C08K 3/08 (2013.01); H01F 27/29 (2013.01); B22F 2301/255 (2013.01); C08K 2003/0806 (2013.01);
Abstract

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, in which a value C/Sis 2.0 to 3.4 where S(m/g) represents a specific surface area of the silver powder, and C(% by mass) represents a content percentage of the binder resin based on the silver powder, a copper content of the silver powder is 10 to 5000 ppm by mass, and the silver paste has a dry film density of 7.50 g/cmor more. The present invention can provide a silver paste containing a powder in a high concentration and excellent in printability, and accordingly provide a silver conductor film that has a high filling factor and a high film density, exhibits high electrical conductivity, and is excellent in migration resistance.

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