The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Mar. 15, 2024
Applicant:

Sensel, Inc., Sunnyvale, CA (US);

Inventors:

Jacob Terracina, Sunnyvale, CA (US);

Ilya Daniel Rosenberg, Sunnyvale, CA (US);

Shuangming Li, Sunnyvale, CA (US);

Darren Lochun, Sunnyvale, CA (US);

Tomer Moscovich, Sunnyvale, CA (US);

Assignee:

Sensel, Inc., Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G06F 3/04142 (2019.05); G06F 3/04166 (2019.05); G06F 3/044 (2013.01);
Abstract

A system includes: a substrate including an edge supported by a chassis; a first electrode spanning a first area of the substrate and arranged proximal a center of the substrate; and a second electrode spanning a second area, greater than the first area, on the substrate and interposed between the first electrode and the edge of the substrate. The system further includes a first coupling region: facing the first electrode; and electrically coupling to the first electrode to yield a first electrical value at the first electrode responsive to application of a first force magnitude proximal the center of the substrate. The system also includes a second coupling region: facing the second electrode; and electrically coupling to the second electrode to yield a second electrical value, approximating the first electrical value, at the second electrode responsive to application of the first force magnitude proximal the center of the substrate.


Find Patent Forward Citations

Loading…