The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Jan. 26, 2023
Nanjing Semidrive Technology Ltd., Nanjing, CN;
Xiongfei Liu, Nanjing, CN;
Qiaoyu Ye, Nanjing, CN;
Shaohui Gong, Nanjing, CN;
Lihang Zhang, Nanjing, CN;
Nanjing SemiDrive Technology LTD., Nanjing, CN;
Abstract
A multi-chip interconnection system includes a plurality of chips. A chip of the plurality of chips includes an extend serial peripheral interface (XSPI) master terminal, a data transmission terminal, an XSPI slave terminal, and a data reception terminal. The XSPI master terminal includes an advanced extensible interface (AXI) slave interface. The data transmission terminal accesses the AXI slave interface via an AXI bus. The XSPI slave terminal includes an AXI master interface. The data reception terminal accesses the AXI master interface via the AXI bus. An XSPI master terminal of a chip is connected to an XSPI slave terminal of another chip via an XSPI bus. The XSPI master terminal of the chip performs encoding on AXI information of the data transmission terminal of the chip received via the AXI bus and transmits encoded AXI information to the XSPI slave terminal of the another chip via the XSPI bus.