The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12339584 B1

Date of Patent:

Jun. 24, 2025

Filed:

Oct. 05, 2022

Substrate conveyance method, substrate conveyance apparatus, molding method, and article manufacturing method

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Osamu Yasunobe, Tochigi, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc. I.P. Division

Primary Examiner:

Jerzi H Moreno Hernandez

Int. Cl.

CPC ...

G03F 7/00 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01); B29C 59/00 (2006.01); H01L 21/677 (2006.01);

U.S. Cl.

CPC ...

G03F 7/0002 (2013.01); B25J 11/0095 (2013.01); B25J 15/0033 (2013.01); B29C 59/002 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 2221/68368 (2013.01);

Abstract

A method for conveying a substrate from a first to a second apparatus is provided. Material is applied to the substrate when on the first apparatus. A substrate conveyance apparatus including first and second holding portions is used. As a first step, the substrate is transferred from a first apparatus placement surface to the substrate conveyance apparatus. The substrate is then conveyed from the first apparatus to the second apparatus. The substrate is then transferred from the first holding portion to the second apparatus. In the first step, raising the first holding portion in a state where the first holding portion is inserted in a space under the substrate causes the first holding portion to hold the substrate, and the second holding portion to hold a protection member by holding a holding and receiving portion provided on a protection member surface opposite to a protection member surface facing the substrate.

Find Patent Forward Citations

Yasunobe, Osamu. (2025). Substrate conveyance method, substrate conveyance apparatus, molding method, and article manufacturing method (U.S. Patent No. 12339584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12339584

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