The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Aug. 02, 2022
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Shi-Wen Lin, Hsin-Chu, TW;

Wei-Chi Liu, Hsin-Chu, TW;

Tsung-Ching Lin, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 21/16 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G03B 21/16 (2013.01); H05K 7/20272 (2013.01);
Abstract

A heat dissipating module includes a casing including a bottom plate and a water inlet; a cover plate disposed on one side of the casing opposite to the bottom plate; a pressurizing device moving back and forth in the casing and having a maximum stroke; a water pump disposed between the bottom plate and the pressurizing device, where liquid fills a space between the water pump and the pressurizing device to define a water tank; and a stop valve disposed in the water tank and located between the pressurizing device and the water pump. According to a direction from the bottom plate to the cover plate, the height of the water inlet is lower than the stop valve. The heat dissipating module has a small volume and is configured to flip at multiple angles. A projection device including the heat dissipating module and having structural reliability is also provided.


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