The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

May. 10, 2021
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

John H. Martin, Oxnard, CA (US);

Brennan D. Yahata, Santa Barbara, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 21/10 (2006.01); B22F 10/00 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B23K 26/144 (2014.01); B23K 26/342 (2014.01); B23K 35/28 (2006.01); B32B 15/01 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); C22C 9/00 (2006.01); C22C 14/00 (2006.01); C22C 19/03 (2006.01); C22C 21/06 (2006.01); C22C 23/00 (2006.01); B23K 26/34 (2014.01); B23K 26/354 (2014.01); B23K 103/08 (2006.01); B23K 103/10 (2006.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
C22C 21/10 (2013.01); B22F 10/00 (2021.01); B22F 10/25 (2021.01); B23K 26/144 (2015.10); B23K 26/342 (2015.10); B23K 35/288 (2013.01); B32B 15/016 (2013.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B22F 10/28 (2021.01); B22F 2301/052 (2013.01); B22F 2301/058 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); B22F 2301/30 (2013.01); B23K 26/34 (2013.01); B23K 26/354 (2015.10); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/14 (2018.08); B23K 2103/15 (2018.08); B33Y 10/00 (2014.12); C22C 9/00 (2013.01); C22C 14/00 (2013.01); C22C 19/03 (2013.01); C22C 21/06 (2013.01); C22C 23/00 (2013.01);
Abstract

Some variations provide a method of making an additively manufactured metal component, comprising: providing a feedstock that includes a high-vapor-pressure metal; exposing a first amount of the feedstock to an energy source for melting; and solidifying the melt layer, thereby generating a solid layer of an additively manufactured metal component. The metal-containing feedstock is enriched with a higher concentration of the high-vapor-pressure metal compared to its concentration in the additively manufactured metal component. The high-vapor-pressure metal may be selected from Mg, Zn, Li, Al, Cd, Hg, K, Na, Rb, Cs, Mn, Be, Ca, Sr, or Ba, for example. Additively manufactured metal components are provided. Metal-containing feedstocks for additive manufacturing are also disclosed, wherein concentration of at least one high-vapor-pressure metal in the feedstock is selected based on a desired concentration of the high-vapor-pressure metal in an additively manufactured metal component derived from the metal-containing feedstock. Various feedstock compositions are disclosed.


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