The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Nov. 05, 2020
Toray Industries, Inc., Tokyo, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
Abstract
An epoxy resin composition includes the following components: [A] epoxy resin, [B] aromatic diamine, and [C] a compound having a boiling point of 130° C. or more, a molecular weight m of 50 to 250 no epoxy group in the molecule and substantially no ability to cure an epoxy resin. The composition also satisfies the following conditions: (1) the ratio H/E between moles E of epoxy groups in [A] and moles H of active hydrogen in [B] is 0.50 to 1.30; (2) at least a part of component [C] satisfies a ratio m/M in a range of 0.10 to 0.60 of the molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition; (3) the ratio C/E of moles E of epoxy groups of [A] to moles C of [C] satisfying condition (2) is 0.01 to 0.20.