The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Oct. 18, 2021
Beijing Forestry University, Beijing, CN;
Power Dekor Group Co., Ltd., Shanghai, CN;
Hunan Forestech New Materials Co., Ltd., Zhuzhou, CN;
Runcang Sun, Beijing, CN;
Tongqi Yuan, Beijing, CN;
Xiaolong Chen, Beijing, CN;
Supeng Wang, Beijing, CN;
Yueying Chen, Beijing, CN;
Xianpeng Zhou, Beijing, CN;
BEIJING FORESTRY UNIVERSITY, Beijing, CN;
POWER DEKOR GROUP CO., LTD., Shanghai, CN;
HUNAN FORESTECH NEW MATERIALS CO., LTD., Zhuzhou, CN;
Abstract
The present invention relates to a formaldehyde-free medium-high-density board capable of meeting deep facing requirements, and a method for manufacturing same. The method includes: wood chipping, screening, cooking and softening, fiber separating, gluing, drying and sorting, paving, pre-pressing, hot pressing, cooling, sanding, and inspection and warehousing, where the gluing is two-step gluing, including: first performing gluing once by using a lignin adhesive, and then performing secondary gluing by using an MDI adhesive after waterproof treatment. According to the manufacturing method of the present invention, by using biomass adhesives and formaldehyde-free adhesives without adding additives such as a curing agent and an anti-mildew agent, formaldehyde pollution is eliminated from the source by using a two-step gluing method, so that production is formaldehyde-free, and the product is formaldehyde-free. Through the sequential control of the gluing process and the grasp of the gluing type and ratio, surface hardness of the product is improved, and the final product is capable of deep facing to reach 20 to 80 filaments.