The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Nov. 10, 2023
Applicant:

Formfactor, Inc., Livermore, CA (US);

Inventors:

Benedikt Marx, Dresden, DE;

Axel Becker, Dresden, DE;

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01); B25J 11/00 (2006.01);
U.S. Cl.
CPC ...
B25J 15/0616 (2013.01); B25J 11/0095 (2013.01);
Abstract

Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.


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