The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Jun. 09, 2020
Applicant:

The Swatch Group Research and Development Ltd, Marin, CH;

Inventors:

Csilla Miko, Essertines-sur-Yverdon, CH;

Anaïs Brait, Moutier, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/66 (2021.01); B22F 12/30 (2021.01); B22F 12/41 (2021.01); B23K 26/12 (2014.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/10 (2020.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/66 (2021.01); B22F 12/30 (2021.01); B22F 12/41 (2021.01); B23K 26/123 (2013.01); B23K 26/127 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/10 (2020.01); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); B22F 2201/11 (2013.01); B22F 2301/052 (2013.01); B22F 2301/255 (2013.01);
Abstract

A method for laser additive manufacturing of a mechanical part includes providing a laser beam the operation of which will be controlled by a computer into which is introduced a CAD computer file which is cut into one or more strata which, once superimposed, allow to form the structure of the desired mechanical part, disposing a substrate in a manufacturing enclosure wherein an atmosphere of a neutral gas is created, depositing on the substrate at least a first layer of a powder of a first metallic material to be melted, levelling the first layer, subjecting by means of the laser beam the first layer to a selective melting step, if necessary, depositing on the substrate a second layer, levelling the second layer and subjecting this second layer to a step of selective melting, removing the excess material and cleaning the assembly and subjecting the part to finishing operations.


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