The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Oct. 04, 2023
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Setagaya, JP;

Yoshiharu Hirakata, Ebina, JP;

Hiroyuki Miyake, Atsugi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/40 (2023.01); G06F 1/16 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H10K 10/88 (2023.01); H10K 59/38 (2023.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H10K 59/40 (2023.02); G06F 1/1652 (2013.01); G06F 3/0412 (2013.01); G06F 3/04164 (2019.05); G06F 3/04184 (2019.05); G06F 3/0445 (2019.05); G06F 3/0446 (2019.05); G06F 3/0447 (2019.05); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); H10K 10/88 (2023.02); H10K 59/38 (2023.02); H10K 77/111 (2023.02);
Abstract

A flexible touch panel is provided. Both reduction in thickness and high sensitivity of a touch panel are achieved. The touch panel includes a first flexible substrate, a first insulating layer over the first substrate, a transistor and a light-emitting element over the first insulating layer, a color filter over the light-emitting element, a pair of sensor electrodes over the color filter, a second insulating layer over the sensor electrodes, a second flexible substrate over the second insulating layer, and a protective layer over the second substrate. A first bonding layer is between the light-emitting element and the color filter. The thickness of the first substrate and the second substrate is each 1 μm to 200 μm inclusive. The first bonding layer includes a region with a thickness of 50 nm to 10 μm inclusive.


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