The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Sep. 07, 2023
Applicant:
The Hong Kong Polytechnic University, Hong Kong, CN;
Inventors:
Feng Yan, Hong Kong, CN;
Jing Zhuang, Hong Kong, CN;
Assignee:
The Hong Kong Polytechnic University, Hong Kong, CN;
Primary Examiner:
Int. Cl.
CPC ...
H10K 30/50 (2023.01); H10K 71/12 (2023.01); H10K 85/50 (2023.01);
U.S. Cl.
CPC ...
H10K 30/50 (2023.02); H10K 71/12 (2023.02); H10K 85/50 (2023.02);
Abstract
This invention provides a perovskite with a modified surface and method for making the same. In one embodiment, said perovskite is a mixed-cation lead halide perovskite; and said modified surface comprises a DPGABr:PbIcomplex layer. In one embodiment, said method for manufacturing a perovskite with a modified surface, comprises the steps of: a) Providing a perovskite with a surface to be modified; b) Treating said surface to be modified with DPGABr; and c) Annealing to form said perovskite with a modified surface.