The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Nov. 24, 2021
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Wei Sin Tan, Plymouth, GB;

Andrea Pinos, Plymouth, GB;

Samir Mezouari, Swindon, GB;

John Lyle Whiteman, St. Austell, GB;

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/24 (2010.01); H01L 33/42 (2010.01); H01L 33/46 (2010.01); H01L 33/62 (2010.01); H10H 20/01 (2025.01); H10H 20/821 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 29/142 (2025.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H10H 20/01 (2025.01); H10H 20/821 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01); H10H 20/857 (2025.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01); H10H 20/032 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01);
Abstract

Disclosed herein are a light source for a display system and methods of fabricating the light source. The light source includes a backplane wafer including a first bonding layer that includes an array of pixel contact pads in a first dielectric layer; a second bonding layer including an array of small metal contact pads in a second dielectric layer; and an array of mesa structures on the second bonding layer and configured to emit light. The second dielectric layer is bonded to the first dielectric layer such that each pixel contact pad of the array of pixel contact pads is in contact with two or more small metal contact pads that are electrically coupled to a same mesa structure of the array of mesa structures.


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