The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jul. 28, 2022
Applicant:

Nikkiso Co., Ltd., Tokyo, JP;

Inventors:

Noritaka Niwa, Ishikawa, JP;

Tetsuhiko Inazu, Ishikawa, JP;

Haruhisa Aida, Ishikawa, JP;

Assignee:

NIKKISO CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/841 (2025.01); H10H 20/01 (2025.01); H10H 20/825 (2025.01); H10H 20/832 (2025.01);
U.S. Cl.
CPC ...
H10H 20/841 (2025.01); H10H 20/01335 (2025.01); H10H 20/032 (2025.01); H10H 20/832 (2025.01); H10H 20/034 (2025.01); H10H 20/825 (2025.01);
Abstract

A semiconductor light-emitting element includes: an n-type semiconductor layer made of an n-type AlGaN-based semiconductor material; an active layer provided on the n-type semiconductor layer and made of an AlGaN-based semiconductor material; a p-type semiconductor layer provided on the active layer; a p-side contact electrode that includes a Rh layer in contact with an upper surface of the p-type semiconductor layer; a p-side electrode covering layer that is in contact with an upper surface and a side surface of the p-side contact electrode and includes a Ti layer, a Rh layer, and a TiN layer stacked successively; a dielectric covering layer that has a connection opening provided on the p-side electrode covering layer and covers the p-side electrode covering layer in a portion different from the connection opening; and a p-side current diffusion layer that connects to the p-side electrode covering layer in the connection opening.


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