The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Mar. 08, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Michel Khoury, Santa Barbara, CA (US);

Lan Yu, Albany, NY (US);

Michael Chudzik, Mountain View, CA (US);

Max Batres, Redwood City, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H10H 20/825 (2025.01); H10H 20/841 (2025.01); H10H 20/855 (2025.01);
U.S. Cl.
CPC ...
H10H 20/825 (2025.01); H10H 20/01 (2025.01); H10H 20/0137 (2025.01); H10H 20/841 (2025.01); H10H 20/855 (2025.01);
Abstract

Exemplary processing methods of forming a semiconductor structure may include forming subpixels on a substrate. Each of the subpixels may include a gallium-and-nitrogen-containing layer formed on an exposed portion of a nucleation layer on the substrate. The subpixels may further include a porosified region formed on or in the gallium-and-nitrogen-containing region, and an active region formed on the porosified region. The active region may include an indium-gallium-and-nitrogen-containing material. The processing methods may further include forming a first reflection layer around one of the subpixels, wherein the first reflection layer includes a first metal layer. The methods may additionally include forming a second reflection layer around another of the subpixels, wherein the second reflection layer includes a second metal that is different than the first metal.


Find Patent Forward Citations

Loading…