The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Sep. 29, 2022
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Christopher M. Helberg, Austin, TX (US);

Christopher M. Jaggers, Austin, TX (US);

Robert Edward Radke, Austin, TX (US);

Mustansir M. Pratapgarhwala, Austin, TX (US);

Michael J. Austin, Austin, TX (US);

Sukesh Shenoy, Austin, TX (US);

Assignee:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); G06F 1/20 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20327 (2013.01); G06F 2200/201 (2013.01); H01L 23/38 (2013.01);
Abstract

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.


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