The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

May. 19, 2020
Applicant:

Vicor Corporation, Andover, MA (US);

Inventors:

Patrick R. Lavery, North Andover, MA (US);

Jeffrey John LeBlanc, Grafton, MA (US);

Patrizio Vinciarelli, Boston, MA (US);

Assignee:

Vicor Corporation, Andover, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/44 (2006.01); H01F 27/30 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/44 (2013.01); H01F 27/306 (2013.01); H01F 41/0246 (2013.01);
Abstract

An inductive device with flux paths through a substrate may be made by depositing a malleable magnetically permeable material into a hole in the substrate and curing the malleable magnetically permeable material to form a substantially solid magnetic plug. Deposition of the malleable magnetically permeable material may comprise stencil-printing followed by use of a flexible runner. A uniform extension of the plug above an outer surface of the substrate may be provided by a spacer on the outer surface. The spacer may, e.g., be a conductive layer and/or a non-conductive material on the surface. Magnetic plates spanning two or more plugs may form a closed magnetic flux path. A plug may be surrounded by a winding on a layer of the substrate. Extension of the plug above an outer surface of the substrate may ensure the integrity of an essentially gap-free connection between the end of the magnetic plug and a mating surfaces of a magnetic plate. The plug may be reduced for co-planarity with the substrate surface, or to form a recess below the substrate surface, e.g. to form controlled gaps in the permeable medium.


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