The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jul. 05, 2022
Applicants:

Carnegie Mellon University, Pittsburgh, PA (US);

Universidade DE Coimbra, Coimbra, PT;

Inventors:

Mahmoud Tavakoli, Coimbra, PT;

Hugo Paisana, Coimbra, PT;

Anibal T. De Almeida, Coimbra, PT;

Carmel Majidi, Pittsburgh, PA (US);

Assignees:

UNIVERSIDADE DE COIMBRA, Coimbra, PT;

CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/24 (2006.01); B41M 3/00 (2006.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/246 (2013.01); B41M 3/006 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/52 (2013.01); H05K 1/0386 (2013.01); H05K 1/097 (2013.01); H05K 3/027 (2013.01); H05K 2203/107 (2013.01); H05K 2203/128 (2013.01);
Abstract

Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature 'sintering' process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.


Find Patent Forward Citations

Loading…