The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Nov. 22, 2022
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Ryoga Kiguchi, Tokyo, JP;

Hiromu Takubo, Tokyo, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10886 (2013.01);
Abstract

A wiring board includes a pair of hard substrates provided for each of a plurality of semiconductor elements connected in parallel; a soft substrate provided so as to be at least partially sandwiched between all of the pairs of hard substrates; a first electrode configured to connect a control terminal of the semiconductor element and the hard substrate or the soft substrate; a second electrode configured to connect a reference potential terminal of the semiconductor element and the hard substrate or the soft substrate; a first wiring configured to connect in parallel the first electrodes of each of the plurality of semiconductor elements, at least part of the first wiring being provided on the soft substrate; and a second wiring configured to connect in parallel the second electrodes of each of the plurality of semiconductor elements, at least part of the second wiring being provided on the soft substrate.


Find Patent Forward Citations

Kiguchi, Ryoga. (2025). Wiring board and power conversion apparatus (U.S. Patent No. 12336094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12336094

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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