The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Feb. 21, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Hiromichi Kitajima, Kyoto, JP;
Takahiro Eguchi, Kyoto, JP;
Nobuaki Ogawa, Kyoto, JP;
Yuki Asano, Kyoto, JP;
Shota Hayashi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member. At least a part of the engraved mark portion is provided in a portion in which the resin member and the metallic shield plate overlap each other when the main surface is viewed in a plan view.