The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Oct. 06, 2023
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Yang Liu, Irvine, CA (US);
Yong Hee Lee, Tustin, CA (US);
Thomas Obkircher, Santa Ana, CA (US);
William J. Domino, Yorba Linda, CA (US);
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03F 1/56 (2006.01); H03F 3/213 (2006.01); H04B 1/3827 (2015.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03F 3/213 (2013.01); H03F 1/565 (2013.01); H04B 1/3827 (2013.01); H04B 1/40 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract
A semiconductor-on-insulator die can include a power amplifier configured to amplify a radio frequency input signal having a fundamental frequency. The die can further include an output matching circuit including first and second second-order harmonic rejection circuits configured to resonate at about two times the fundamental frequency and a third order harmonic rejection circuit configured to resonate at about three times the fundamental frequency.