The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Oct. 28, 2022
Applicant:
Te Connectivity Solutions Gmbh, Schaffhausen, CH;
Inventors:
Charles Raymond Gingrich, Iii, Mechanicsburg, PA (US);
Scott Eric Walton, Mount Joy, PA (US);
Rutger Wilhelmus Smink, Hamont-Achel, BE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6471 (2011.01); H01R 12/72 (2011.01); H01R 13/6587 (2011.01); H01R 13/6588 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 12/724 (2013.01); H01R 13/6587 (2013.01); H01R 13/6588 (2013.01);
Abstract
A printed circuit board having signal contact receiving vias positioned in rows and ground contact receiving vias positioned in line with the signal contact receiving vias in the rows. Signal integrity vias are positioned between the signal contact receiving vias, between the ground contact receiving vias, and between respective signal contact receiving vias and respective ground contact receiving vias. The signal integrity vias form a ground fence which reduces cross talk in a foot print of a connector mated with the printed circuit board.