The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Apr. 17, 2024
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Daisuke Yasuda, Tokyo, JP;
Takanori Yamashita, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/124 (2021.01); H01G 11/30 (2013.01); H01G 11/82 (2013.01);
U.S. Cl.
CPC ...
H01M 50/1243 (2021.01); H01G 11/30 (2013.01); H01G 11/82 (2013.01);
Abstract
A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. A first heat-fusible resin layer, among the heat-fusible resin layers, that constitutes the surface of the laminate has a logarithmic decrement ΔE of no more than 0.20 in a rigid body pendulum measurement at 140° C.