The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Mar. 30, 2022
Denso Corporation, Kariya, JP;
Syuhei Miyachi, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor module includes: two semiconductor elements stacked in a vertical direction to overlap at least a part of the semiconductor elements; a conductive member stacked on the semiconductor elements and electrically connected to at least one of the semiconductor elements; and a resin mold integrally sealing the semiconductor elements and the conductive member. A lower semiconductor element has at least observable positions of both ends of two sides substantially orthogonal to each other when viewed from above in the vertical direction without arranging the resin mold.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile