The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Feb. 07, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takuya Shiratsuru, Tokyo, JP;

Shoji Saito, Tokyo, JP;

Katsuhiko Kondo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/56 (2013.01); H01L 23/492 (2013.01); H01L 23/49541 (2013.01); H01L 23/562 (2013.01);
Abstract

In a semiconductor device, a frame includes a first frame portion extending in a direction parallel to a connection surface to be connected to the connection surface and a second frame portion connecting a case and the first frame portion. The first frame portions are divided into a plurality of divided portions. At least one divided portion in the plurality of divided portions in the first frame portions is an elastic portion which can be elastically deformed from a first state where a tip end portion is inclined to be located on a lower side of the connection surface to a second state where the tip end portion extends in a direction parallel to the connection surface. The divided portion as the elastic portion is connected to the connection surface while being elastically deformed from the first state to the second state.


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