The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Nov. 01, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ji Hye Han, Suwon-si, KR;

Jung Min Kim, Suwon-si, KR;

Hong Je Choi, Suwon-si, KR;

Byung Woo Kang, Suwon-si, KR;

Hye Jin Park, Suwon-si, KR;

Sang Wook Lee, Suwon-si, KR;

Bon Seok Koo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.


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