The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Mar. 22, 2022
Tdk Corporation, Tokyo, JP;
Akihiko Oide, Tokyo, JP;
Makoto Yoshino, Tokyo, JP;
Tomoki Okada, Yurihonjo, JP;
Hideki Saitou, Yurihonjo, JP;
Seiji Osada, Yurihonjo, JP;
Kazuhiro Ebina, Tokyo, JP;
Kunio Oda, Tokyo, JP;
Takashi Abe, Yurihonjo, JP;
Akio Shibata, Tokyo, JP;
Kazuo Iwai, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.