The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jul. 05, 2024
Applicant:
Toppan Holdings Inc., Tokyo, JP;
Inventor:
Shin Kataoka, Tokyo, JP;
Assignee:
TOPPAN HOLDINGS INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); H01Q 1/2283 (2013.01);
Abstract
A contactless communication medium including an IC module and a plurality of metal plates. Each of the plurality of metal plates has a through hole and a slit. At least two or more metal plates are laminated via an insulating layer. The metal plates include a first metal plate and a second metal plate. The second metal plate extends across the slit of the first metal plate in plan view of the first metal plate and adds electrostatic capacitance between portions of the slit of the first metal plate.