The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Sep. 08, 2023
Qualcomm Incorporated, San Diego, CA (US);
Prakhar Srivastava, Lucknow, IN;
Santhosh Reddy Akavaram, Hyderabad, IN;
Aditya Singh Patel, Jabalpur, IN;
Ravi Kumar Sepuri, Hyderabad, IN;
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
The disclosed techniques store certain information of functional modules and lanes to optimize a die-to-die interconnect link. Based on the information, the apparatus can optimize a link width and a multi-module link configuration of the interconnect link. An integrated circuit device includes a first die, a second die, and a die-to-die (D2D) interconnect link connected between the first die and the second die. The D2D interconnect link includes a plurality of lanes grouped into a plurality of modules. The apparatus maintains a training result of the D2D interconnect link based on the training of the D2D interconnect link, the training result including one or more link configurations of the plurality of modules. The apparatus selects a link configuration of the one or more link configurations to configure the D2D interconnect link including one or more of the plurality of modules.