The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Aug. 18, 2023
Applicant:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Inventors:

Hossein Haj-Hariri, Charlottesville, VA (US);

Reza Monazami, Cambridge, MA (US);

Assignee:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); B64G 1/50 (2006.01); B64G 1/58 (2006.01); F01D 5/18 (2006.01); F25B 21/02 (2006.01); F28D 15/02 (2006.01); F28F 13/18 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); B64G 1/50 (2013.01); B64G 1/58 (2013.01); F01D 5/187 (2013.01); F25B 21/02 (2013.01); F28D 15/02 (2013.01); F28D 15/046 (2013.01); F28F 13/187 (2013.01); H01L 23/427 (2013.01); F05D 2210/14 (2013.01); F05D 2260/207 (2013.01); F05D 2260/213 (2013.01); H01L 2924/0002 (2013.01); Y02T 50/60 (2013.01);
Abstract

A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using anon-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members. For example it can be used to cool a computer chip, a skin of a hypersonic flying object, parabolic solar collector, turbine or engine blade, or any other heat source that requires high heat flux.


Find Patent Forward Citations

Loading…