The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

May. 21, 2020
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventor:

Koichi Ueno, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 65/38 (2006.01); B65D 5/60 (2006.01); B65D 30/08 (2006.01); B65D 81/24 (2006.01); C08L 1/02 (2006.01); C08L 97/02 (2006.01); D21C 3/00 (2006.01); D21H 11/18 (2006.01);
U.S. Cl.
CPC ...
B65D 65/38 (2013.01); B65D 5/60 (2013.01); B65D 31/04 (2013.01); B65D 81/24 (2013.01); C08L 1/02 (2013.01); C08L 97/02 (2013.01); D21C 3/00 (2013.01); D21H 11/18 (2013.01);
Abstract

The purpose of the present invention is to provide: a container in which a cellulose resin composition can be stored without discoloring with the lapse of time; a package comprising a cellulose resin composition and the container; a method in which a cellulose resin composition is inhibited from discoloring by using the container; and a method for producing a molded resin object, the method including using the container. The container, which is for containing a cellulose resin composition comprising a thermoplastic resin and cellulose, includes a high-lignin-content member, which has a lignin content of 10 mass % or higher, and a low-lignin-content member, which has a lignin content of 1 mass % or less, and has a surface to be in contact with the cellulose resin composition, the whole of the surface being constituted of the low-lignin-content member.


Find Patent Forward Citations

Loading…