The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Mar. 16, 2023
Sensorview Co., Ltd., Seongnam-si, KR;
Byoung Nam Kim, Suwon-si, KR;
Hong Il Yoo, Gwangmyeong-si, KR;
Jong Yup Lee, Incheon, KR;
Chul-Keun Park, Seongnam-si, KR;
SENSORVIEW CO., LTD., Seongnam-si, KR;
Abstract
A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.