The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jun. 15, 2023
Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Takeshi Fujikawa, Tokyo, JP;

Makoto Yasuhara, Tokyo, JP;

Sadayuki Fukui, Tokyo, JP;

Assignee:

Daicel Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4845 (2013.01); B29C 65/526 (2013.01); B29C 2793/0027 (2013.01); B29K 2995/0097 (2013.01); B29L 2011/0016 (2013.01);
Abstract

A manufacturing method for an optical unit includes: molding a first wafer in which a plurality of the first optical elements are formed; molding a second wafer in which a plurality of the second optical elements are formed; forming a bonding portion in a first peripheral portion surrounding the first optical element or a second peripheral portion corresponding to the first peripheral portion and surrounding the second optical element; bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element; and cutting the first wafer and the second wafer at the first and second peripheral portions in a state where the first and second wafers are bonded to each other to dice an optical unit, in which the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.


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