The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jun. 11, 2020
Corning Incorporated, Corning, NY (US);
Jonas Bankaitis, Horseheads, NY (US);
Duc Anh Bui, Krailling, DE;
Scott Steven Cronk, Webster, NY (US);
Christopher Paul Daigler, Cedar Park, TX (US);
Christina Marie Laskowski, Painted Post, NY (US);
Neil Eugene Partridge, Avoca, NY (US);
Uwe Stute, Neustadt am Rubenberge, DE;
Sergio Tsuda, Horseheads, NY (US);
Chad Michael Wilcox, Warrenton, VA (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.