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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12330212 B1

PDFFull Text
Date of Patent:
Jun. 17, 2025

Filed:

Feb. 15, 2021

Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Issei Otani, Tokyo, JP;

Hiroaki Tatsumi, Tokyo, JP;

Jumpei Sawada, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

BUCHANAN, INGERSOLL & ROONEY PC

Primary Examiner:

Zandra V Smith

Assistant Examiner:

John M Parker

Int. Cl.
CPC ...
B22F 1/18 (2022.01); B22F 1/00 (2022.01); B22F 7/08 (2006.01); H01B 1/22 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
B22F 1/18 (2022.01); B22F 1/00 (2013.01); B22F 7/08 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.

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Otani, Issei. (2025). Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device (U.S. Patent No. 12330212). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12330212

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