The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Apr. 26, 2022
Applicant:

Shanghai Tianma Micro-electronics Co., Ltd., Shanghai, CN;

Inventors:

Zhenhai Yin, Shanghai, CN;

Shanshan Liu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/167 (2013.01); H10D 86/021 (2025.01); H10D 86/451 (2025.01); H01L 24/16 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/03011 (2013.01); H01L 2224/039 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/16148 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A curved light-emitting substrate and its formation method, and a display apparatus are provided in the present disclosure. The curved light-emitting substrate includes a substrate; an array layer, disposed on a side of the substrate; a plurality of light-emitting elements, electrically connected to the array layer, where a light-emitting element of the plurality of light-emitting elements includes a light-emitting main body and a first soldering pad on a side of the light-emitting main body facing the array layer; a second soldering pad which is on a side of the array layer facing the light-emitting element and electrically connected to the first soldering pad; and a flexible padding layer, between the light-emitting main body and the array layer along a first direction, where the first direction is perpendicular to a surface of the array layer.


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