The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Dec. 20, 2021
Oki Electric Industry Co., Ltd., Tokyo, JP;
Yuuki Shinohara, Tokyo, JP;
Takahito Suzuki, Tokyo, JP;
Kenichi Tanigawa, Tokyo, JP;
Hironori Furuta, Tokyo, JP;
Toru Kosaka, Tokyo, JP;
Yusuke Nakai, Tokyo, JP;
Shinya Jyumonji, Tokyo, JP;
Genichirou Matsuo, Tokyo, JP;
Takuma Ishikawa, Tokyo, JP;
Chihiro Takahashi, Tokyo, JP;
Hiroto Kawada, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.