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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12328928 B1

PDFFull Text
Date of Patent:
Jun. 10, 2025

Filed:

Dec. 20, 2021

Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof

Applicant:

Oki Electric Industry Co., Ltd., Tokyo, JP;

Inventors:

Yuuki Shinohara, Tokyo, JP;

Takahito Suzuki, Tokyo, JP;

Kenichi Tanigawa, Tokyo, JP;

Hironori Furuta, Tokyo, JP;

Toru Kosaka, Tokyo, JP;

Yusuke Nakai, Tokyo, JP;

Shinya Jyumonji, Tokyo, JP;

Genichirou Matsuo, Tokyo, JP;

Takuma Ishikawa, Tokyo, JP;

Chihiro Takahashi, Tokyo, JP;

Hiroto Kawada, Tokyo, JP;

Assignee:

Oki Electric Industry Co., Ltd., Tokyo, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Stanley Tso

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H10D 64/01 (2025.01); H10D 64/62 (2025.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10D 64/62 (2025.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H10D 64/01 (2025.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32227 (2013.01);
Abstract

A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.

Find Patent Forward Citations

Shinohara, Yuuki. (2025). Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof (U.S. Patent No. 12328928). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12328928

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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