The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Oct. 30, 2019
Applicant:

Csmc Technologies Fab2 Co., Ltd., Wuxi, CN;

Inventors:

Dong Fang, Wuxi, CN;

Zheng Bian, Wuxi, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/66 (2025.01); H10D 30/01 (2025.01); H10D 64/00 (2025.01);
U.S. Cl.
CPC ...
H10D 30/668 (2025.01); H10D 30/0297 (2025.01); H10D 64/117 (2025.01);
Abstract

The present application relates to a semiconductor device, comprising a substrate, with a body region being formed on the substrate, and a well region being formed in the body region; and further comprising trenches penetrating through the well region and the body region and extending to the substrate, wherein a first polysilicon body and a second polysilicon body, which are isolated from each other, are respectively formed at the bottom and the top of each trench to form a split gate structure, the trenches are filled with an inter-layer dielectric layer, a conductive plug penetrating through the inter-layer dielectric layer and extending into the first polysilicon body is formed in each trench, the conductive plug is isolated from the second polysilicon body by means of the inter-layer dielectric layer, the conductive plug is connected to a source electrode, and the second polysilicon body is connected to a gate electrode.


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