The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Oct. 31, 2022
Applicant:

Ametek, Inc., Berwyn, PA (US);

Inventors:

Joo-Han Kim, Huntsville, AL (US);

Brian Hoden, Albuquerque, NM (US);

Lucius Akalanne, Chippenham, GB;

Assignee:

AMETEK, INC., Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H05K 1/0204 (2013.01); H05K 7/1418 (2013.01); H05K 7/20281 (2013.01);
Abstract

A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.


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